By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent details on a mainstream technique that's severe for high-volume, high-yield semiconductor production, or even extra in order gadget dimensions proceed to diminish. The know-how has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the machine and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This vital ebook deals a scientific evaluate of basics and advances within the zone. half One covers CMP of dielectric and steel movies, with chapters concentrating on using specific strategies and tactics, and on CMP of specific numerous fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP techniques.
Part addresses consumables and technique regulate for better CMP, and contains chapters at the education and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor approaches, and methods for defection characterization, mitigation, and reduction.
- Considers innovations and tactics for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and technique keep an eye on for more suitable CMP
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Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu